THERMAL GAP FILLING

Thermally-conductive gap fillers or thermal interface materials are used in many areas of electronics, such as sensing systems, controller units and transmission modules or battery systems. They act as a thermal bridge between a hot component (such as a circuit board) and a heat spreader (e.g. housing) to dissipate heat away from the component and prevent its failure from overheating. The advantage of using gap fillers is that they provide a soft, form-in-place elastomer that fills all the unique and intricate air voids and gaps. This is invaluable particularly in the production of fragile assemblies, where alternatives that are not component shape-specific (e.g. gap-filling elastomeric pads) can cause damage by over-stressing solder joints and leads.

The process of thermal gap filler application involves a highly abrasive, two-part material, which is metered and homogenously mixed, before it is dispensed in usually very small shots. The material then cures in place, either in room or elevated temperature. The application requires a special dispensing system robust enough to withstand the flow of abrasive particles and precise enough to operate with very small components.

Designed specifically to withstand highly abrasive material, the system PAR 2EH is our solution to gap filling and potting processes, where thermal interface materials are applied to transfer heat away from components. The system can be interfaced with automated systems for fully or semiautomatic applications.